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| CHT3091AQAG RoHS COMPLIANT DC-12GHz ATTENUATOR GaAs Monolithic Microwave IC in SMD leadless package Description The CHT3091AQAG is a variable DC-12GHz attenuator designed for a wide range of applications, from military to commercial communication systems. It is supplied in lead-free SMD package. Main Features Broadband performances: DC-12GHz dBSij (dB) . 0 -5 S11dBmin_Board S11dBmax_Board S21dBmin_Pkg S21dBmin_Board S21dBmax_Board S21dBmax_Pkg 15dBm typical input 1dB compression point ( any attenuation) DC bias: -5V -15 -20 Package type: 16Leads QFN3x3. -25 2 3 4 5 6 7 8 9 10 Frequency (GHz) 11 12 13 14 PCB Measured performances @ 20 C Main Characteristics Tamb. = 25 C Symbol Fin Min Att. Max Att. Pin1dB Parameter Input frequency range Minimum attenuation |S21| (VS=0V;VP=-5V) Maximum attenuation |S21| (VS=-5V;VP=0V) Input 1dB compression point.(any attenuation) Min DC Typ Max 12 Unit GHz dB dB dBm 3 20 14 23 4 ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions! Ref. : DSCHT3091AQAG7085 - 26 Mar 07 1/6 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Departementale 128 - B.P.46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHT3091AQAG Absolute Maximum Ratings Tamb. = 25 (1) C Symbol VP VS Pin Ta Tstg (1) VP control voltage VS control voltage RF input power Operating temperature range Storage temperature range Parameter Values -6V -6V 20 -40 to +85 -55 to +155 Attenuator Unit V V dBm C C Operation of this device above anyone of these parameters may cause permanent damage. Main Characteristics Tamb. = 25 C Symbol Fin Min Att. Max Att. VSWRin Parameter Input frequency range Minimum attenuation |S21| (VS=0V;VP=-5V) Maximum attenuation |S21| (VS=-5V;VP=0V) Input VSWR (any attenuation) Min DC Typ Max 12 Unit GHz dB dB 3.0 20 23 2.:1 2.:1 14 15 4.0 VSWRout Output VSWR (any attenuation) Pin1dB Input 1dB compression point.(any attenuation) dBm These values are representative of onboard measurements as defined in the application section. ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions! Typical Bias Conditions For an ambient Temperature of +25 C Symbol Vs Vp Pin No. 6 7 VS control voltage VP control voltage Parameter Values -5 to 0 0 to -5 Unit V V All other pins are not used for this device (but RFin: pin 2 and RFout: pin 11). Ref. : DSCHT3091AQAG7085 - 26 Mar 07 2/6 Specifications subject to change without notice Route Departementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Attenuator Demonstration Board (PCB) CHT3091AQAG R FIN RU FO T C T3091 H Typical Results Tamb = +25 C Vp = 0V to -5V & Vs = -5V to 0V PCB Measured Performance (T amb. 25 C) 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -11 -12 -13 -14 -15 -16 -17 -18 -19 -20 -21 -22 -23 -24 -25 2 3 S11dBmin_Board S21dBmin_Board S11dBmax_Board S21dBmax_Board S21dBmin_Pkg S21dBmax_Pkg dBS21 & dBS11 (dB) 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Frequency (GHz) Ref. DSCHT3091AQAG7085 - 26 Mar 07 3/6 Specifications subject to change without notice Route Departementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHT3091AQAG Attenuator Application note The design of the motherboard has a strong impact on the over all performance since the transition from the motherboard to the package is comparably large. In case of the SMD type packages of United Monolithic Semiconductors the motherboard should be designed according to the information given in the following to achieve good performance. Other configurations are also possible but can lead to different results. If you need advise please contact United Monolithic Semiconductors for further information. SMD type packages of UMS should allow design and fabrication of micro- and mm-wave modules at low cost. Therefore, a suitable motherboard environment has been chosen. All tests and verifications have been performed on Rogers RO4003. This material exhibits a permittivity of 3.38 and has been used with a thickness of 200m [8 mils] and a 1/2oz or less copper cladding. The corresponding 50Ohm transmission line has a strip width of about 460m [approx. 18 mils]. The contact areas on the motherboard for the package connections should be designed according to the footprint given above. The proper via structure under the ground pad is very important in order to achieve a good RF and lifetime performance. All tests have been done by using a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the centres of two adjacent vias. The via grid should cover the whole space under the ground pad and the vias closest to the RF ports should be located near the edge of the pad to allow a good RF ground connection. Since the vias are important for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a grid of via's is recommended. For the mounting process the SMD type package can be handled as a standard surface mount component. The use of either solder or conductive epoxy is possible. The solder thickness after reflow should be typical 50m [2 mils] and the lateral alignment between the package and the motherboard should be within 50m [2 mils]. Caution should be taken to obtain a good and reliable contact over the whole pad areas. Voids or other improper connections, in particular, between the ground pads of motherboard and package will lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product. Ref. : DSCHT3091AQAG7085 - 26 Mar 07 4/6 Specifications subject to change without notice Route Departementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Attenuator CHT3091AQAG Recommended footprint for 16L-QFN3x3 The RF ports are not DC blocked. There are no DC capacitors in the package. SMD mounting procedure The SMD leadless package has been designed for high volume surface mount PCB assembly process. The dimensions and footprint required for the PCB (motherboard) are given in the drawings above. For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0005. Ref. DSCHT3091AQAG7085 - 26 Mar 07 5/6 Specifications subject to change without notice Route Departementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHT3091AQAG Package outline: Attenuator Ordering Information QFN 3x3 lead-free package: CHT3091AQAG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHT3091AQAG7085 - 26 Mar 07 6/6 Specifications subject to change without notice Route Departementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 |
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